Szczegóły publikacji

Opis bibliograficzny

Fabrication and detailed analysis of 22.0% rear junction double-side TOPCon solar cell with front $SiO_x$ /Polysilicon selective emitter / Wook-Jin Choi, Young-Woo Ok, Kwan Hong Min, Ruohan Zhong, Sagnik Dasgupta, Vijaykumar D. Upadhyaya, Gabby De Luna, John Derek Arcebal, Pradeep PADHAMNATH, Ajeet Rohatgi // W: PVSC 52 [Dokument elektroniczny] : IEEE 52nd Photovoltaic Specialist Conference : 9-14 June 2024, Seattle, USA. — Wersja do Windows. — Dane tekstowe. — [Piscataway] : IEEE, cop. 2024. — (Photovoltaic Specialists Conference ; ISSN 0160-8371). — Dod. ISBN: 978-1-6654-7582-2 (Print on Demand). — e-ISBN: 978-1-6654-6426-0. — S. 1778–1782. — Wymagania systemowe: Adobe Reader. — Bibliogr. s. 1781–1782, Abstr. — P. Padhamnath - dod. afiliacja: Solar Energy Research Institute of Singapore, Singapore

Autorzy (10)

  • Choi Wook-Jin
  • Ok Young-Woo
  • Min Kwan Hong
  • Zhong Ruohan
  • Dasgupta Sagnik
  • Upadhyaya Vijaykumar D.
  • De Luna Gabby
  • Arcebal John Derek
  • AGHPadhamnath Pradeep
  • Rohatgi Ajeet

Dane bibliometryczne

ID BaDAP156885
Data dodania do BaDAP2025-01-24
Tekst źródłowyURL
DOI10.1109/PVSC57443.2024.10749511
Rok publikacji2024
Typ publikacjimateriały konferencyjne (aut.)
Otwarty dostęptak
WydawcaInstitute of Electrical and Electronics Engineers (IEEE)
Czasopismo/seriaPhotovoltaic Specialists Conference

Abstract

This paper presents a cost-effective and scalable fabrication process for high-quality selective double-side tunnel oxide passivating contact (DS-TOPCon) solar cells, featuring a front SiOx/Poly -Si selective emitter. A novel two-tier co-diffusion process simultaneously forms phosphorus-and boron-doped poly-Si layers on both sides in a single step, eliminating the need for additional masking and diffusion processes. The full-area DS-TOPCon cell precursors, fabricated through this rapid process, demonstrated the best iVoc of 738 mV and iFF of 86.3%. An inkj et-based patterning technique for the full-area front poly-Si, coupled with n-Si field re-passivation process, retains the passivation quality, and successfully transforms it into selective DS-TOPCon cell precursor. Initial device fabrication on large area Czochralski (Cz) n-Si wafers achieved 22.0% cell efficiency with 714 mV open-circuit voltage Voc ) after post-metallization treatments (laser enhanced contact optimization and light/heat treatment). These results suggest that with further process optimizations and improvements in material and contact properties, the efficiency of selective DS-TOPCon solar cells has potential to surpass 25%, making it a promising alternative to fabricate high-efficiency next-generation solar cells at low-cost.

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fragment książki
#156883Data dodania: 24.1.2025
Formation of selective TOPCon front surface field with excellent passivation for high-efficiency back-junction solar cells / Sagnik Dasgupta, Pradeep PADHAMNATH, Wook-Jin Choi, Young-Woo Ok, Ajeet Rohatgi // W: PVSC 52 [Dokument elektroniczny] : IEEE 52nd Photovoltaic Specialist Conference : 9-14 June 2024, Seattle, USA. — Wersja do Windows. — Dane tekstowe. — [Piscataway] : IEEE, cop. 2024. — (Photovoltaic Specialists Conference ; ISSN 0160-8371). — Dod. ISBN: 978-1-6654-7582-2 (Print on Demand). — e-ISBN: 978-1-6654-6426-0. — S. 1253–1256. — Wymagania systemowe: Adobe Reader. — Bibliogr. s. 1256, Abstr.
fragment książki
#156882Data dodania: 24.1.2025
Characterization and modeling of thin n-Type and thick p-Type polysilicon passivated contacts for back-junction solar cells / Ruohan Zhong, Pradeep PADHAMNATH, Gabby De Luna, John Derek Dumaguin Arcebal, Vijaykumar Upadhyaya, Sagnik Dasgupta, Daniel L. Meier, Ajeet Rohatgi // W: PVSC 52 [Dokument elektroniczny] : IEEE 52nd Photovoltaic Specialist Conference : 9-14 June 2024, Seattle, USA. — Wersja do Windows. — Dane tekstowe. — [Piscataway] : IEEE, cop. 2024. — (Photovoltaic Specialists Conference ; ISSN 0160-8371). — Dod. ISBN: 978-1-6654-7582-2 (Print on Demand). — e-ISBN: 978-1-6654-6426-0. — S. 843–846. — Wymagania systemowe: Adobe Reader. — Bibliogr. s. 845–846, Abstr.