Szczegóły publikacji
Opis bibliograficzny
Novel solder pastes in respect to void formation on the example of LED assembly / Barbara DZIURDZIA, Maciej Sobolewski, Janusz Mikołajek // W: IMAPS Poland 2018 conference [Dokument elektroniczny] : 42nd International Microelectronics and Packaging : September 23–26, 2018, Gliwice. — Wersja do Windows. — Dane tekstowe. — [Gliwice : s. n.], [2018]. — S. [1–3]. — Wymagania systemowe: Adobe Reader. — Tryb dostępu: http://imaps.aei.polsl.pl/index.php/for-authors [2019-03-29]. — Bibliogr. s. [3], Abstr. — Tekst dostępny po zalogowaniu
Autorzy (3)
- AGHDziurdzia Barbara
- Sobolewski Maciej
- Mikołajek Janusz
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 120961 |
|---|---|
| Data dodania do BaDAP | 2019-03-30 |
| Rok publikacji | 2018 |
| Typ publikacji | materiały konferencyjne (aut.) |
| Otwarty dostęp |  |
Abstract
In this paper two lead-free solder pastes by ALPHA Metals CVP-390 and OM-340 have been compared considering void formation in solder joints under thermal and electrical pads of LED packages. CVP-390 and OM-340 are the pastes of Innolot type and contain, besides tin, silver and copper, additionally some amount of antimony, nickel and bismuth. Solder joints were performed with convection reflow soldering at mass production environment in Fideltronik Ltd., Sucha Beskidzka and inspected there with 2D Automated Xray Inspection System. Statistical analysis of results didn't confirm the significant difference in void contents and distribution for both pastes analyzed.
