Szczegóły publikacji
Opis bibliograficzny
New experimental approach to void phenomena in SMT joints / Maciej Sobolewski, Barbara DZIURDZIA // W: IMAPS Poland 2018 conference [Dokument elektroniczny] : 42nd International Microelectronics and Packaging : September 23–26, 2018, Gliwice. — Wersja do Windows. — Dane tekstowe. — [Gliwice : s. n.], [2018]. — S. [1–4]. — Wymagania systemowe: Adobe Reader. — Tryb dostępu: http://imaps.aei.polsl.pl/index.php/for-authors [2019-03-29]. — Bibliogr. s. [3], Abstr. — Tekst dostępny po zalogowaniu
Autorzy (2)
- Sobolewski Maciej
- AGHDziurdzia Barbara
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 120962 |
|---|---|
| Data dodania do BaDAP | 2019-03-30 |
| Rok publikacji | 2018 |
| Typ publikacji | materiały konferencyjne (aut.) |
| Otwarty dostęp |  |
Abstract
In this paper a new experimental approach to void phenomena in a macroscopic solder joint formed between a copper cylinder and a copper plate with using SMT has been presented. The copper cylinder operates as a model of an electronic component, the copper plate as a model of a PCB. A solder joint between a copper cylinder and a copper plate is created by reflow soldering with application of the lead free solder paste. Difference in temperature between both sides of a solder joint has been measured with K-type thermocouples in order to establish thermal conductivity of a solder connection. The correlation between the thermal conductivity and void contents as well as thickness of a solder joint and various microdefects of a solder layer has been studied.
