Szczegóły publikacji
Opis bibliograficzny
3D printed K-band air-filled waveguide directional coupler integrated with PCB using a through-patch transition / Ilona PIEKARZ, Jakub SOROCKI, Sławomir GRUSZCZYŃSKI, Krzysztof WINCZA // W: MIKON 2022 [Dokument elektroniczny] : 2022 24th international Microwave and Radar Conference (MIKON) : September 12-14, 2022, Gdańsk, Poland. — Piscataway : IEEE ; Warsaw : University of Technology, cop. 2022. — Dod. ISBN 978-83-956020-2-3 (USB ISBN), 978-1-6654-1106-6 (print on demand). — e-ISBN: 978-83-956020-3-0. — S. 1-3. — Wymagania systemowe: Adobe Reader. — Bibliogr. s. 3, Abstr.
Autorzy (4)
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 144770 |
|---|---|
| Data dodania do BaDAP | 2023-01-25 |
| DOI | 10.23919/MIKON54314.2022.9924833 |
| Rok publikacji | 2022 |
| Typ publikacji | materiały konferencyjne (aut.) |
| Otwarty dostęp |  |
| Wydawcy | Institute of Electrical and Electronics Engineers (IEEE), Uniwersytet Warszawski |
Abstract
In this paper, a recently developed highly integrated hybrid fabricated stack-up is explored for the implementation of passive waveguide microwave front-end components such as power dividers/combiners. The stack-up leverages the additive manufacturing for integration of a 3D printed and metal-coated air-filled waveguide with a Printed Circuit Board (PCB) by sharing a common ground plane, which allows for further integration with active circuitry. A through-patch transition is used to interconnect the two guides. The concept was experimentally verified by fabrication and measurements of an exemplary equal power split directional coupler in WR-42 waveguide geometry to operate at f0 = 20 GHz being fed by on-PCB microstrip lines. © 2022 Warsaw University of Technology.
