Szczegóły publikacji
Opis bibliograficzny
Additively fabricated air-filled waveguide integrated with printed circuit board using a through-patch transition / Jakub SOROCKI, Ilona PIEKARZ, Andrzej Samulak, Nicolo Delmonte, Lorenzo Silvestri, Stefania Marconi, Gianluca Alaimo, Ferdinando Auricchio, Maurizio Bozzi // IEEE Microwave and Wireless Components Letters ; ISSN 1531-1309. — 2021 — vol. 31 no. 11, s. 1207–1210. — Bibliogr. s. 1209–1210, Abstr. — Publikacja dostępna online od: 2021-09-22
Autorzy (9)
- AGHSorocki Jakub
- AGHPiekarz Ilona Kinga
- Samulak Andrzej
- Delmonte Nicolo
- Silvestri Lorenzo
- Marconi Stefania
- Alaimo Gianluca
- Auricchio Ferdinando
- Bozzi Maurizio
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 138097 |
|---|---|
| Data dodania do BaDAP | 2021-12-10 |
| Tekst źródłowy | URL |
| DOI | 10.1109/LMWC.2021.3112567 |
| Rok publikacji | 2021 |
| Typ publikacji | artykuł w czasopiśmie |
| Otwarty dostęp |  |
| Creative Commons | |
| Czasopismo/seria | IEEE Microwave and Wireless Components Letters |
Abstract
The hybrid integration of an additively fabricated air-filled waveguide (WG) with a printed circuit board (PCB) is presented. An arrangement is proposed where different waveguiding structures share the same common metal plane on PCB. Such an approach allows combining the low-loss and high-Q properties of an air-filled waveguide, active circuit realization of the strip transmission line, and 3-D capabilities of additive manufacturing. A broadband transition is developed employing a through-patch coupling interface from a microstrip (MS) line to a waveguide. The concept was experimentally validated with exemplary transitions operating within X-band and K-band, featuring a measured bandwidth of f(h)/f(l) approximate to 1.4 and average per-transition loss including connecting lines of similar to 1.2 and similar to 1.9 dB, respectively.