Szczegóły publikacji
Opis bibliograficzny
The role of equipotential bondings as a measure of protection against electric shock by the example of special installations / Anna Dąda, Paweł Błaut, Karol Sidor // W: Photonics applications in astronomy, communications, industry, and high-energy physics experiments 2019 : 26 May–2 June 2019, Wilga, Poland / eds. Ryszard S. Romaniuk, Maciej Linczuk. — Wersja do Windows. — Dane tekstowe. — Bellingham : SPIE, cop. 2019. — (Proceedings of SPIE / The International Society for Optical Engineering ; ISSN 0277-786X ; vol. 11176). — ISBN: 9781510630659; e-ISBN: 9781510630666. — S. 111765O-1–111765O-10. — Bibliogr. s. 111765O-10, Abstr. — A. Dąda, P. Błaut - afiliacja: MGGP S. A., Krakow Branch, Krakow
Autorzy (3)
- Dąda Anna
- Błaut Paweł
- Sidor Karol
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 134067 |
|---|---|
| Data dodania do BaDAP | 2021-05-12 |
| Tekst źródłowy | URL |
| DOI | 10.1117/12.2536726 |
| Rok publikacji | 2019 |
| Typ publikacji | materiały konferencyjne (aut.) |
| Otwarty dostęp |  |
| Wydawca | SPIE - The International Society for Optics and Photonics |
| Czasopismo/seria | Proceedings of SPIE / The International Society for Optical Engineering |
Abstract
Equipotential bondings are low-resistance electrical connections of various conductive parts, which aim is to equalize their potentials. In Poland, equipotential bondings are required in each building to which electricity has been supplied. If equipotential bondings have not been carried out, users are exposed to dangerous touch voltage between the simultaneously accessible conductive parts. This paper will include an analysis of the requirements for protection against electric shock for locations containing a bath or shower, based on the PN-HD 60364-7-701:2010 standard. A computer simulation will be performed to indicate the probable dangerous situations. On its basis, there will be made an attempt to identify solutions that will guarantee the highest effectiveness and reliability of the protection against electric shock. Particular attention will be paid to the protection measures of the additional shock protection in the form of equipotential bondings.
