Szczegóły publikacji
Opis bibliograficzny
Influence of a soldering process on thermal parameters of large power LED modules / Barbara DZIURDZIA, Krzysztof Górecki, Przemysław Ptak // IEEE Transactions on Components, Packaging and Manufacturing Technology ; ISSN 2156-3950. — 2019 — vol. 9 no. 11, s. 2160–2167. — Bibliogr. s. 2166, Abstr. — Publikacja dostępna online od: 2019-02-12
Autorzy (3)
- AGHDziurdzia Barbara
- Górecki Krzysztof
- Ptak Przemysław
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 126369 |
|---|---|
| Data dodania do BaDAP | 2020-01-27 |
| Tekst źródłowy | URL |
| DOI | 10.1109/TCPMT.2019.2898713 |
| Rok publikacji | 2019 |
| Typ publikacji | artykuł w czasopiśmie |
| Otwarty dostęp |  |
| Czasopismo/seria | IEEE Transactions on Components, Packaging and Manufacturing Technology |
Abstract
In this paper, the results of investigations concerning the influence of a soldering process on the thermal properties of large LED modules are presented. The convection reflow soldering and vapor phase soldering are considered. The quality of the performed connections is evaluated by means of measurements with X-rays and thermal parameters of single diodes contracted in the examined modules, and the whole modules are measured. It is shown that by using the vapor phase soldering, considerably more efficient cooling of the examined LED modules could be obtained, which can increase their lifetime.
