Szczegóły publikacji

Opis bibliograficzny

Application of 3-D printing technology for the realization of high-performance directional couplers in suspended stripline technique / Jakub SOROCKI, Ilona PIEKARZ, Sławomir GRUSZCZYŃSKI, Krzysztof WINCZA, John Papapolymerou // IEEE Transactions on Components, Packaging and Manufacturing Technology ; ISSN 2156-3950. — 2019 — vol. 9 no. 8, s. 1652–1658. — Bibliogr. s. 1657, Abstr. — Publikacja dostępna online od: 2019-03-07

Autorzy (5)

Słowa kluczowe

3D printingcompensation techniquesuspended stripline techniquecoupled line directional coupleradditive manufacturing

Dane bibliometryczne

ID BaDAP124943
Data dodania do BaDAP2020-01-15
Tekst źródłowyURL
DOI10.1109/TCPMT.2019.2903437
Rok publikacji2019
Typ publikacjiartykuł w czasopiśmie
Otwarty dostęptak
Czasopismo/seriaIEEE Transactions on Components, Packaging and Manufacturing Technology

Abstract

In this paper, a novel approach for the realization of high-performance coupled-line directional couplers in suspended stripline technique is proposed, taking advantage of the recent development in 3-D printing technology. An enhanced 2.5-D dielectric structure is introduced, allowing to combine the advantages of strip transmission line techniques, for which the circuit can still be considered as a quasi-planar structure, with the 3-D printing flexibility allowing to realize locally variable air layer thicknesses limited only by technological constraints. It is shown that the proposed approach is especially useful when tight coupling, as for which thick air layer in the coupled-line region is required and compact structure is of need. Moreover, compensating elements, often required to improve couplers' performance, can easily be realized as a combination of a circuit mosaic and varied ground plane for better circuit volume utilization. An example of a 3-dB coupled-line directional coupler operating within the ISM 5.8-GHz band is designed, manufactured, and measured for the experimental verification. The obtained results confirm the applicability of the proposed approach.

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