Szczegóły publikacji
Opis bibliograficzny
Application of aerosol jet 3-D printing with conductive and nonconductive inks for manufacturing mm-wave circuits / Ilona PIEKARZ, Jakub SOROCKI, Michael Thomas Craton, Krzysztof WINCZA, Sławomir GRUSZCZYŃSKI, John Papapolymerou // IEEE Transactions on Components, Packaging and Manufacturing Technology ; ISSN 2156-3950. — 2019 — vol. 9 no. 3, s. 586–595. — Bibliogr. s. 593–594, Abstr.
Autorzy (6)
- AGHPiekarz Ilona Kinga
- AGHSorocki Jakub
- Craton Michael Thomas
- AGHWincza Krzysztof
- AGHGruszczyński Sławomir
- Papapolymerou John
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 120654 |
|---|---|
| Data dodania do BaDAP | 2019-06-25 |
| Tekst źródłowy | URL |
| DOI | 10.1109/TCPMT.2018.2889698 |
| Rok publikacji | 2019 |
| Typ publikacji | artykuł w czasopiśmie |
| Otwarty dostęp | |
| Czasopismo/seria | IEEE Transactions on Components, Packaging and Manufacturing Technology |
Abstract
In this paper, an application of Aerosol Jet 3D printing with conductive and non-conductive inks for the realization of mm-wave circuits well above 30 GHz is presented and investigated. The Optomec 5X aerosol jet 3D printing system is used together with polyimide and silver inks to fully-additive manufacture various microstrip circuits. A section of microstrip transmission line with a transition to a via-less conductor backed coplanar waveguide was designed together with a T-junction and a branch-line coupler. These circuits were designed to operate within the Ka and V frequency bands. The measured thickness of the polyimide dielectric substrate is 20.7 ± 1.35 μm while the silver traces are 2.6 ± 1.35 μm. A section of the transmission line with the developed transitions was measured up to the W-band, exhibiting a total loss of 0.65 dB/mm at 100 GHz. The T-junction power divider yielded a total loss at its center frequency of 34 GHz of 0.55 dB. The 3-dB branch line coupler yielded a loss at its center frequency at 42 GHz of 1.1 dB. The experimental results demonstrate the application of this approach for fast and high-resolution mm-wave circuit fabrication. IEEE