Szczegóły publikacji
Opis bibliograficzny
Convection vs vapour phase reflow in LED and BGA assembly / Barbara DZIURDZIA, Maciej Sobolewski, Janusz Mikołajek // Soldering & Surface Mount Technology ; ISSN 0954-0911. — 2018 — vol. 30 iss. 2 spec. iss., s. 87–99. — Bibliogr. s. 98–99, Abstr. — 21st European Microelectronics and Packaging Conference (EMPC) : 41st IMAPS-Poland International Conference on Where West Meets East : Warsaw, 10-13 September 2017
Autorzy (3)
- AGHDziurdzia Barbara
- Sobolewski Maciej
- Mikołajek Janusz
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 113670 |
|---|---|
| Data dodania do BaDAP | 2018-05-10 |
| Tekst źródłowy | URL |
| DOI | 10.1108/SSMT-10-2017-0031 |
| Rok publikacji | 2018 |
| Typ publikacji | referat w czasopiśmie |
| Otwarty dostęp |  |
| Czasopismo/seria | Soldering & Surface Mount Technology |
Abstract
Purpose The aim of this paper is to evaluate using statistical methods how two soldering techniques - the convection reflow and vapour phase reflow with vacuum - influence reduction of voids in lead-free solder joints under Light Emitted Diodes (LEDs) and Ball Grid Arrays (BGAs). Design/methodology/approach Distribution of voids in solder joints under thermal and electrical pads of LEDs and in solder balls of BGAs assembled with convection reflow and vapour phase reflow with vacuum has been investigated in terms of coverage or void contents, void diameters and number of voids. For each soldering technology, 80 LEDs and 32 solder balls in BGAs were examined. Soldering processes were carried out in the industrial or semi-industrial environment. The OM340 solder paste of Innolot type was used for LED soldering. Voidings in solder joints were inspected with a 2D X-ray transmission system. OriginLab was used for statistical analysis. Findings Investigations supported by statistical analysis showed that the vapour phase reflow with vacuum decreases significantly void contents and number and diameters of voids in solder joints under LED and BGA packages when compared to convection reflow. Originality/value Voiding distribution data were collected on the basis of 2D X-ray images for test samples manufactured during the mass production processes. Statistical analysis enabled to appraise soldering technologies used in these processes in respect of void formation.
