Szczegóły publikacji
Opis bibliograficzny
Convection vs vapour phase reflow in LED assembly / Barbara DZIURDZIA, Maciej Sobolewski, Janusz Mikołajek // W: IMAPS Poland 2017 conference ; EMPC 2017 [Dokument elektroniczny] : 41th International Microelectronics and Packaging conference ; European Microelectronics Packaging Conference : September 11–13, 2017, Warsaw. — Wersja do Windows. — Dane tekstowe. — [Warszawa : s. n.], [2017]. — Dysk Flash. — S. [1–14] Contribution\_i142\_i167. — Wymagania systemowe: Adobe Reader. — Bibliogr. s. [13–14], Summ. — Publ. z konferencji IMAPS Poland 2017
Autorzy (3)
- AGHDziurdzia Barbara
- Sobolewski Maciej
- Mikołajek Janusz
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 112022 |
|---|---|
| Data dodania do BaDAP | 2018-02-02 |
| Rok publikacji | 2017 |
| Typ publikacji | materiały konferencyjne (aut.) |
| Otwarty dostęp |  |
| Konferencje | 41th International Microelectronics and Packaging, European Microelectronics Packaging Conference |
Abstract
The paper compares convection vs vapour phase reflow on the example of LED assembly. The criterion is void contents in solder joints of Cree LEDs assembled on metal cladded PCBs with convection and vapour phase reflow soldering. Vacuum is incorporated into vapour phase soldering and lead free materials are used. Voiding remains the important issue in the assembly of power devices with large thermal pads. They reduce the effective solder cross-section area available for heat transfer and subsequently result in an increase in thermal resistance of a solder joint. Many means are applied to minimize void contents. One of them is using vapour phase soldering with vacuum instead of convection soldering. The aim of the paper is to show to which extent this replacement affects voiding.
