Szczegóły publikacji
Opis bibliograficzny
Thermal and power delivery considerations of the 65k pixel 3-D integrated radiation imaging module with through-silicon vias / Krzysztof KASIŃSKI // W: MIXDES 2017 : Mixed Design of integrated circuits and systems : book of abstracts of 24th international conference : Bydgoszcz, Poland, June 22–24, 2017 / ed. by Andrzej Napieralski. — Łódź : Lodz University of Technology. Department of Microelectronics and Computer Science, cop. 2017. — ISBN do pełnego tekstu. — W bazie Web of Science ISBN: 978-8-3635-7812-1. — ISBN: 978-83-63578-11-4. — S. 122. — Abstr. — Pełny tekst dostępny online: https://mixdes.org/downloads/MIXDES2017.pdf [2017-07-20]. — S. 435–439. — Wymagania systemowe: Adobe Reader. — Bibliogr. s. 439, Abstr.
Autor
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 106855 |
|---|---|
| Data dodania do BaDAP | 2017-08-03 |
| Rok publikacji | 2017 |
| Typ publikacji | materiały konferencyjne (aut.) |
| Otwarty dostęp |  |
| Wydawca | Politechnika Łódzka |
| Konferencja | International Conference "Mixed Design of Integrated Circuits and Systems" 2017 |
Abstract
Single photon counting pixel hybrid detectors are becoming increasingly popular in high energy physics, X-ray detectors for synchrotron applications and medical imaging. They utilize various detector materials and are built using different micro-assembly approaches. Typically readout chips for these detectors have the area of a few cm(2) and are designed to be abutted on 3 sides. Large area detectors with no or minimum dead areas are required by many applications. This paper shows thermal and power supply design considerations of the 3-D integrated 2-chip, 2 cm x 2 cm, plug-in radiation imaging modules fabricated using through-silicon vias and redistribution layer deposition micro assembly technologies.
