Szczegóły publikacji
Opis bibliograficzny
Bulk nanomaterials and powders consolidation produced by Cyclic Extrusion Compression / Maria RICHERT, Jan RICHERT, Beata LESZCZYŃSKA-MADEJ, Agnieszka HOTLOŚ // Key Engineering Materials ; ISSN 1013-9826. — 2016 — vol. 682, s. 276–283. — Bibliogr. s. 283, Abstr. — Engineering and technology on Non-ferrous metals : selected, peer reviewed papers from the 2nd International Conference on Non-Ferrous Metals (ICNFM'2015) : June 22–24, 2015, Cracow, Poland / eds. Małgorzta Perek-Nowak, Grzegorz Boczkal. — Switzerland: Trans Tech Publications Ltd, cop. 2016. — ISBN 978-3-03835-733-9
Autorzy (4)
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 96215 |
|---|---|
| Data dodania do BaDAP | 2016-02-19 |
| DOI | 10.4028/www.scientific.net/KEM.682.276 |
| Rok publikacji | 2016 |
| Typ publikacji | referat w czasopiśmie |
| Otwarty dostęp | |
| Czasopismo/seria | Key Engineering Materials |
Abstract
The cyclic extrusion compression - reciprocating extrusion process is one of severe plastic deformation methods, which allow to produce bulk nanomaterials without changing the initial shape of deformed samples. The results are presented showing that the average grains size and microbands thickness in aluminium alloys decrease below 100 nm. The investigations revealed that the average grains size is about 250 nm and 200 nm in polycrystalline and monocrystalline copper, respectively. The cyclic extrusion compression method is also used to produce bulk materials by powder consolidation. The subgrains/nanograins inside the silver powder particles after the consolidation processes achieved the mean size of about 100 nm. Moreover, it has been found that inside structure observed by TEM, the consolidated powder granules consisted from nanometric twins of about 10-20 nm. This silver based powder consolidated by cyclic extrusion compression method were extruded by hydrostatic extrusion method. The final product were the wires with a diameter of 3 mm, which were used to electrical contacts production. © 2016 Trans Tech Publications.