Szczegóły publikacji
Opis bibliograficzny
Research of chemical composition influence on the mechanical and electrical properties of $Al-Mg-Si$ wires / Beata SMYRAK, Marek GNIEŁCZYK, Bartosz JURKIEWICZ, Tadeusz KNYCH, Kinga KORZEŃ, Michał JABŁOŃSKI, Andrzej MAMALA, Andrzej NOWAK // Key Engineering Materials ; ISSN 1013-9826. — 2016 — vol. 682, s. 138–142. — Bibliogr. s. 142, Abstr. — Engineering and technology on Non-ferrous metals : selected, peer reviewed papers from the 2nd International Conference on Non-Ferrous Metals (ICNFM'2015) : June 22–24, 2015, Cracow, Poland / eds. Małgorzta Perek-Nowak, Grzegorz Boczkal. — Switzerland: Trans Tech Publications Ltd, cop. 2016. — ISBN 978-3-03835-733-9
Autorzy (8)
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 96131 |
|---|---|
| Data dodania do BaDAP | 2016-02-18 |
| DOI | 10.4028/www.scientific.net/KEM.682.138 |
| Rok publikacji | 2016 |
| Typ publikacji | referat w czasopiśmie |
| Otwarty dostęp | |
| Czasopismo/seria | Key Engineering Materials |
Abstract
The subject of the work focuses on hardened-precipitation type alloys Al-Mg-Si which constitute the primary component material used to build homogeneous electric wires, type AAAC (All Aluminium Alloy Conductor). The material in consideration is a well-known and well-studied alloy, particularly in terms of the possibilities for using it in thermal treatment processes. However, the subject literature does not present a comprehensive recognition of the effect of heat treatment parameters on the set of mechanical and electrical properties in wires grade 6101. In particular, the study presents the results of experiments that show the possibility of controlling the AlMgSi wire properties by means of selecting the heat treatment parameters for simultaneously obtaining a high tensile strength and high electrical conductivity. Hence, the research described in this paper focuses mostly on determining the impact of the Mg and Si content on the electrical and mechanical properties of wires of Al-Mg-Si wire alloys. © 2016 Trans Tech Publications.