Szczegóły publikacji
Opis bibliograficzny
The influence of extrusion ratio on the strenght of hot extruded aluminium alloy chips / NOGA Piotr, WZOREK Łukasz, WIEWIÓRA Jakub // W: Metal 2015 : 24th international conference on Metallurgy and materials : June 3rd–5th 2015, Brno, Czech Republic : proceedings of abstracts / TANGER Ltd., [et al.]. — Ostrava : TANGER Ltd., cop. 2015. — ISBN: 978-80-87294-58-1. — S. 156. — Pełny tekst na dołączonym CD-ROMie. — S. [1–6] poz. 4024. — Wymagania systemowe: Adobe Reader. — Bibliogr. s. [6], Abstr. — W bazie Web of Science ISBN: 978-80-87294-62-8, odmienna kolejność nazwisk autorów oraz zakres stron: 1600–1604
Autorzy (3)
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 90166 |
|---|---|
| Data dodania do BaDAP | 2015-07-09 |
| Rok publikacji | 2015 |
| Typ publikacji | materiały konferencyjne (aut.) |
| Otwarty dostęp |  |
| Konferencja | 24th international conference on Metallurgy and materials |
Abstract
Hot-extrusion of the chips and other highly fragmented materials is a very convenient way for aluminum alloys scarp processing. It is possible to achieve ready or semi-finished products in one step of material forming directly from the chips to the bulk material. The mechanical properties of such processed material are affected by various extrusion conditions: temperature, extrusion speed and cross-section reduction ratio.. The variation of cross-section reduction ratio has an effect on chips bonding quality, which in turn results in different mechanical properties. The objective of the present study is to analyze mechanical and structural features of 6060 and AlSi11 aluminum alloys after plastic consolidation by hot extrusion with different cross-section reduction ratio in the range of 7 to 45. Aluminum alloy in the form of chips, were preliminarily cold compacted to produce cylindrical billets. The as-compressed billets were then hot extruded at 450 degrees C. The samples cut from as extruded rods were subjected to tensile test and structural SEM observations. Based on obtained results minimum extrusion ratio required for sound bonding of chips was established.
