Szczegóły publikacji
Opis bibliograficzny
Magnetic-aligned, magnetic-filled epoxy composites with enhanced thermal conductivity / Karolina GĄSKA, Grzegorz Kmita, Andrzej Rybak, Robert Sekuła, Kamil GOC, Czesław KAPUSTA // Journal of Materials Science ; ISSN 0022-2461. — 2015 — vol. 50 iss. 6, s. 2510–2516. — Bibliogr. s. 2516, Abstr. — Publikacja dostępna online od: 2015-01-06
Autorzy (6)
- AGHGąska Karolina
- Kmita Grzegorz
- Rybak Andrzej
- Sekuła Robert
- AGHGoc Kamil
- AGHKapusta Czesław
Dane bibliometryczne
| ID BaDAP | 89303 |
|---|---|
| Data dodania do BaDAP | 2015-06-12 |
| Tekst źródłowy | URL |
| DOI | 10.1007/s10853-014-8809-8 |
| Rok publikacji | 2015 |
| Typ publikacji | artykuł w czasopiśmie |
| Otwarty dostęp |  |
| Czasopismo/seria | Journal of Materials Science |
Abstract
This paper investigates the influence of magnetic field-assisted filler alignment technology on the morphology and the thermal conductivity of magnetite-filled epoxy composites. A magnetic field was applied during the solidification of the composite in order to change the position of the filler and its distribution in the polymer matrix. It is shown that the applied procedure leads to the filler being oriented along the direction of the magnetic field, and as a result, the thermal conductivity is improved by up to 120 % compared to a composite with randomly oriented filler obtained without the assistance of a magnetic field. This positive effect is caused by the appearance of conductive paths at a much lower content of the filler when the composite solidification is assisted by a magnetic field, relative to an equivalent isotropic sample. These morphological changes were confirmed by microscopic and X-ray microtomography imaging. The temperature dependences of thermal conductivity were also investigated over a broad temperature range for a magnetite-filled epoxy composite sample and compared to the bulk magnetite reference, showing that thermal behaviour of the magnetite-filled composite is stable, which is a promising result when considering the future application of the technology.
