Szczegóły publikacji

Opis bibliograficzny

Microstructure evolution of aluminium deformed by combination of KoBo extrusion and differential speed rolling (DSR) / Adelajda BRZOSTOWICZ, Wojciech Polkowski // Diffusion and Defect Data – Solid State Data. Part B, Solid State Phenomena ; ISSN 1012-0394. — 2015 — vol. 225, s. 77–84. — Bibliogr. s. 83–84, Abstr. — „Wear Processes 2012” : international conference : Świnoujście, Poland, from 12 to 14 of September 2012

Autorzy (2)

Słowa kluczowe

ultrafine-grained materialsKOBO method differentaial speed rollingsevere plastic deformation

Dane bibliometryczne

ID BaDAP87214
Data dodania do BaDAP2015-02-13
Tekst źródłowyURL
DOI10.4028/www.scientific.net/SSP.225.77
Rok publikacji2015
Typ publikacjireferat w czasopiśmie
Otwarty dostęptak
Czasopismo/seriaDiffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena

Abstract

In the present paper results of a microstructure examination of aluminum deformed by a two step process composed of a combination of two continuous straining methods - the KoBo extrusion and a cold rolling have been shown. The cold rolling was conducted in two variants - with an equal speed of both rolls (ESR) and with a differentiation of the upper ad the lower roll speed (a differential speed rolling - DSR). Results of a transmission electron microscopy (TEM) analysis revealed that applied processing strongly affects a microstructure of the examined material. It is shown that selected parameters of the KoBo extrusion allow obtaining a fine grained material with a grain size in the range of 1÷3 μm. Since a subsequent deformation of as KoBo extruded aluminum bars through the conventional rolling (ESR) leads to a formation of normally observed structural features (e.g. deformation bands), an application of the DSR methods results with a further grain refinement effect. It is found that, the KoBo extrusion combined with the DSR deformation allows obtaining aluminum plates that are characterized by a homogeneous structure with the grain size in the submicron range. © (2015) Trans Tech Publications, Switzerland.

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