Szczegóły publikacji
Opis bibliograficzny
Results of tests of three-dimensionally integrated chips bonded to sensors / Grzegorz W. Deptuch, [et al.], Paweł GRYBOŚ, Piotr KMON, [et al.], Piotr MAJ, [et al.], Robert SZCZYGIEŁ, [et al.] // W: 2013 IEEE NSS/MIC [Dokument elektroniczny] : Nuclear Science Symposium & Medical Imaging Conference : October 27 – November 2, Seoul, Korea / guest ed. Yong Choi ; Institute of Electrical and Electronics Engineers. — Wersja do Windows. — Dane tekstowe. — [Piscataway : IEEE], cop. 2013. — 1 dysk optyczny. — e-ISBN: 978-1-4799-3423-2. — S. [1–5]. — Wymagania systemowe: Adobe Reader ; napęd CD-ROM. — Bibliogr. s. [5], Abstr. — G. Deptuch – afiliacja: Fermi National Accelerator Laboratory, USA. — W bazie Web of Science wersja drukowana. — ISBN 978-1-4799-0534-8. — W bazie Web of Science brak afiliacji AGH
Autorzy (11)
Dane bibliometryczne
| ID BaDAP | 81315 |
|---|---|
| Data dodania do BaDAP | 2014-05-14 |
| DOI | 10.1109/NSSMIC.2013.6829434 |
| Rok publikacji | 2013 |
| Typ publikacji | materiały konferencyjne (aut.) |
| Otwarty dostęp |  |
| Konferencja | 60th IEEE Nuclear Science Symposium / Medical Imaging Conference / 20th International Workshop on Room-Temperature Semiconductor X-ray and Gamma-ray Detectors |
Abstract
The VIPIC1 pixel readout integrated circuit was designed for high timing resolution, pixel based, X-ray Photon Correlation Spectroscopy experiments, typically using 8 keV Xrays at a synchrotron radiation facility. Technical hurdles related to a very aggressive alignment resulted in delays with delivery of 3D bonded wafers that eventually yielded operational devices. Recent improvements in alignment of wafers bonded with the Cu-Cu thermo-compression method and resorting to the CuDBI r bonding method started providing operational devices that were tested and led to the next steps. These were the tests with radioactive sources, emitting X-rays, executed after bonding of individual 3D dies to Silicon pixelated sensors for the first time. Results of these tests are presented.
