Szczegóły publikacji
Opis bibliograficzny
Design and tests of the vertically integrated photon imaging chip / Grzegorz W. Deptuch, Gabriella Carini, Paweł GRYBOŚ, Piotr KMON, Piotr MAJ, Marcel Trimpl, David P. Siddons, Robert SZCZYGIEŁ, Raymond Yarema // IEEE Transactions on Nuclear Science ; ISSN 0018-9499. — 2014 — vol. 61 no. 1, s. 663–674. — Bibliogr. s. 673–674, Abstr. — G. Deptuch – afiliacja: Fermi National Accelerator Laboratory, USA
Autorzy (9)
- Deptuch Grzegorz
- Carini G. A.
- AGHGryboś Paweł Leonard
- AGHKmon Piotr
- AGHMaj Piotr
- Trimpl Marcel
- Siddons D. P.
- AGHSzczygieł Robert
- Yarema Raymond
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 80286 |
|---|---|
| Data dodania do BaDAP | 2014-03-04 |
| Tekst źródłowy | URL |
| DOI | 10.1109/TNS.2013.2294673 |
| Rok publikacji | 2014 |
| Typ publikacji | artykuł w czasopiśmie |
| Otwarty dostęp |  |
| Czasopismo/seria | IEEE Transactions on Nuclear Science |
Abstract
The Vertically Integrated Photon Imaging Chip (VIPIC) project explores opportunities of the three-dimensional integration for imaging of X-rays. The design details of the VIPIC1 chip are presented and are followed by results of testing of the chip. The VIPIC1 chip was designed in a 130 nm process, in which through silicon vias are embedded right after the front-end-of-line processing. The integration of tiers is achieved by the Cu-Cu thermo-compression or Cu-based oxide-oxide bonding. The VIPIC1 readout integrated circuit was designed for high timing resolution, pixel based, X-ray Photon Correlation Spectroscopy experiments typically using 8 keV X-rays at a synchrotron radiation facility. The design was done for bonding a Silicon pixel detector, however other materials can be serviced as long as the positive polarity of charge currents is respected.
