Szczegóły publikacji
Opis bibliograficzny
Migration effects at conductor / XLPE interface subjected to partial discharges at different electrical stresses / M. Florkowski, B. FLORKOWSKA, J. ROEHRICH, A. Rybak, P. ZYDROŃ // W: CEIDP : 2013 annual report conference on Electrical Insulation and Dielectric Phenomena : October 20–23, 2013, Shenzhen, China, Vol. 2 / IEEE Dielectrics and Electrical Insulation Society. — Piscataway, NJ : Institute of Electrical and Electronics Engineers, Inc., cop. 2013. — (Annual report – Conference on Electrical and Dielectric Phenomena ; ISSN 0084-9162). — ISBN: 978-1-4799-2596-4; e-ISBN: 978-1-4799-2597-1. — S. 1189–1192. — Bibliogr. s. 1192, Abstr.
Autorzy (5)
- Florkowski Marek
- AGHFlorkowska Barbara
- AGHRoehrich Józef
- Rybak A.
- AGHZydroń Paweł
Dane bibliometryczne
| ID BaDAP | 79760 |
|---|---|
| Data dodania do BaDAP | 2014-02-14 |
| Rok publikacji | 2013 |
| Typ publikacji | materiały konferencyjne (aut.) |
| Otwarty dostęp |  |
| Konferencja | IEEE Annual Report Conference on Electrical Insulation and Dielectric Phenomena |
| Czasopismo/seria | Annual report - Conference on Electrical Insulation and Dielectric Phenomena |
Abstract
Migration effects occurring at conductor/XLPE interface are presented in the paper. The phenomenon was studied under various electrical stresses: direct current (DC), pulse-width modulated (PWM) and sinusoidal (SIN). The comparison of aging effects on specimens subjected to the stimuli was presented. The electrical stress results in partial discharges, both around the electrode in the form of surface discharges and directly at the micro air gap interface between conductor and polymeric material. In order to isolate the impact of interface discharges, the surface effects were suppressed, eliminated and compared with results containing both forms of discharges. The electrical and thermal mechanism was investigated in the paper and assessment was performed by means of time to breakdown and both micro morphological and elemental analysis. Migration of the conductor, where metallic particles are transferred to the insulating medium, was observed. Primarily, attention was afforded to the migration of copper and aluminum electrode atoms in two zones; one zone being the direct contact area at the interface and the second zone incorporating the area surrounding the electrode which is enhanced by surface discharges. A novel aspect relates to the investigation of the migration depth profile and the concentration intensity at different voltage stresses. The transport phenomena were analyzed with respect to both electrical and thermal mechanisms.
