Szczegóły publikacji
Opis bibliograficzny
Rheological inactivity of AlMgSi conductors (AAAC) in trend of negative stress gradients / Beata SMYRAK, Tadeusz KNYCH, Andrzej MAMALA, Kinga KORZEŃ // Materials Science Forum ; ISSN 0255-5476. — Tytuł poprz.: Diffusion and Defect Monograph Series. — 2013 — vol. 765, s. 808–812. — Bibliogr. s. 812, Abstr. — Light Metals Technology 2013 : selected, peer reviewed papers from the Sixth International Light Metals Technology Conference (LMT'2013) : July 24–26, 2013, Old Windsor, United Kingdom / eds. Ian Stone, Brian McKay, Zhongyun Fan
Autorzy (4)
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 74596 |
|---|---|
| Data dodania do BaDAP | 2013-07-19 |
| DOI | 10.4028/www.scientific.net/MSF.765.808 |
| Rok publikacji | 2013 |
| Typ publikacji | referat w czasopiśmie |
| Otwarty dostęp |  |
| Czasopismo/seria | Materials Science Forum |
Abstract
The authors of this paper present the research results of low temperature creep of AlMgSi (6101) wires and AAAC - All Aluminium Alloy Conductor. The conductor is made from AlMgSi wires (diameter 2.99 mm). Based on theoretical analysis it was proved that creep of an overhead conductors depends on the relation between stress and temperature of conductor and the span geometry. Thus the objective of the paper is to determine the wire and conductor creep under the conditions of stress drop. On the basis of the research it has been observed that the creep of both the AAAC conductor and the AlMgSi wires temporarily stopped.
