Szczegóły publikacji
Opis bibliograficzny
Texture and mechanical properties of electrodeposited copper thin films / A. BUNSCH, S. J. SKRZYPEK, J. KOWALSKA, W. RATUSZEK, W. RAKOWSKI // Diffusion and Defect Data – Solid State Data . Part B, Solid State Phenomena ; ISSN 1012-0394. — 2010 — vol. 163, s. 141–144. — Bibliogr. s. 144, Abstr. — XXI conference on Applied Crystallography : 20–24 September 2009 Zakopane, Poland
Autorzy (5)
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 52279 |
|---|---|
| Data dodania do BaDAP | 2010-06-14 |
| Tekst źródłowy | URL |
| DOI | 10.4028/www.scientific.net/SSP.163.141 |
| Rok publikacji | 2010 |
| Typ publikacji | referat w czasopiśmie |
| Otwarty dostęp |  |
| Czasopismo/seria | Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena |
Abstract
Influence of the electrodepositing parameters e.g. applied electric current as variable on texture formation and on mechanical properties of copper thin films was studied. Experiment was done for copper deposition from sulphate bath under galvanostatic and pulse current. It was found that copper layers exhibits different texture depending on applied current conditions during electrodepositing process. Pulse and direct current conditions leads to different texture of electrodeposited copper. Texture of electrodeposited copper coatings and mechanical properties could be correlated. It was found that, texture indexes although are not complex information about texture could be used for analysis of such correlation in technological process.
