Szczegóły publikacji
Opis bibliograficzny
Influence of temperature on electroless deposition of $Co-P$ / E. RUDNIK, P. Skrzyniarz // Transactions of the Institute of Metal Finishing ; ISSN 0020-2967. — 2007 — vol. 85 no. 2, s. 82–86. — Bibliogr. s. 86. — Publikacja dostępna online od: 2013-07-18
Autorzy (2)
- AGHRudnik Ewa
- Skrzyniarz P.
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 45458 |
|---|---|
| Data dodania do BaDAP | 2009-06-09 |
| Tekst źródłowy | URL |
| DOI | 10.1179/174591907X177723 |
| Rok publikacji | 2007 |
| Typ publikacji | artykuł w czasopiśmie |
| Otwarty dostęp |  |
| Czasopismo/seria | Transactions of the Institute of Metal Finishing |
Abstract
Electroless cobalt deposition on copper substrates using sodium hypophosphite as a reductant was investigated. The electroless plating was initiated by contact with an aluminium wire (Cu-Al galvanic cell). It was found that measurements of substrate potential are very useful for monitoring of the process. The rate of cobalt deposition was in the range of 0.7 x 10(-3) -4.4 x 10(-3) mg cm-(2) min(-1) for the temperature range of 338-358 K. The activation energy for cobalt deposition was determined to be similar to 93 kJ mol(-1). The plating efficiency of 13-24% was estimated. Cobalt films were matt grey with many tiny pits (with diameter of 0.1 mu m) on the surface.
