Szczegóły publikacji

Opis bibliograficzny

Internal stress and stored energy in recrystallized copper — Naprężenia własne i energia zgromadzona w procesie rekrystalizacji miedzi / K. WIERZBANOWSKI, A. BACZMAŃSKI, R. WAWSZCZAK, J. TARASIUK [et al.] // Archives of Metallurgy and Materials / Polish Academy of Sciences. Committee of Metallurgy. Institute of Metallurgy and Materials Science ; ISSN 1733-3490. — 2005 — vol. 50 spec. iss. 1, s. 201–208. — Bibliogr. s. 207–208. — SOTAMA-FGM : Symposium on Texture and Microstructure Analysis of Functionally Graded Materials : October 3–7, 2004, Kraków, Poland / eds. Elżbieta Bielańska, Jan T. Bonarski ; Polish Academy of Sciences. Institute of Metallurgy and Materials Science. — Warszawa–Kraków : [s. n.], 2005

Autorzy (7)

Słowa kluczowe

peak widthresidual stresscrystallographic texturemodellingrecrystallizationmulti-reflection methodstored energy

Dane bibliometryczne

ID BaDAP23085
Data dodania do BaDAP2005-08-02
Rok publikacji2005
Typ publikacjireferat w czasopiśmie
Otwarty dostęptak
Czasopismo/seriaArchives of Metallurgy and Materials

Abstract

The multi-reflection X-ray method was used to determine the stress level in deformed and recrystallized polycrystalline copper samples. The anisotropic diffraction elastic constants were calculated using the self- consistent model and crystallographic texture. A significant decrease of the first order residual stresses was observed during recrystallization, but they start to decrease already during recovery. Diffraction peak widths and intensities were also examined. A complementary study, using synchrotron radiation and electron back scattering diffraction techniques was done in order to determine the stored energy in the examined material. This latter is strongly orientation dependent and has the lowest value in the cubic orientation, which is dominating one in recrystalization texture.

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artykuł
#22429Data dodania: 25.5.2005
Residual stress and stored energy during recrystallisation in polycrystalline copper / K. WIERZBANOWSKI, A. BACZMAŃSKI, R. WAWSZCZAK, J. TARASIUK, Ph. Gerber, B. Bacroix, A. Lodini // Materials Science and Technology ; ISSN 0267-0836. — 2005 — vol. 21 no. 1, s. 46–52. — Bibliogr. s. 52. — Publikacja dostępna online od: 2013-07-19
artykuł
#20784Data dodania: 16.3.2005
Residual stress variation in polycrystalline copper during recrystallization / K. WIERZBANOWSKI, A. BACZMAŃSKI, R. WAWSZCZAK, B. Bacroix, A. Lodini // Journal of Neutron Research ; ISSN  1023-8166 . — 2004 — vol. 12 iss. 1–3, s. 201–205. — Bibliogr. s. 205