Szczegóły publikacji
Opis bibliograficzny
Testing setup of IntelPixel hybrid X-ray detector with on-chip and in-pixel artificial neural network / M. JURCZAK, P. MARCHUT, P. MAJ, A. KOZIOŁ // Journal of Instrumentation [Dokument elektroniczny]. — Czasopismo elektroniczne ; ISSN 1748-0221 . — 2026 — vol. 21 iss. 1 art. no. C01028, s. [1], 1–9. — Wymagania systemowe: Adobe Reader. — Bibliogr. s. 9, Abstr. — Publikacja dostępna online od: 2026-01-22. — 26th international workshop on Radiation imaging detectors : Bratislava, Slovakia, 6–10 July 2025
Autorzy (4)
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 167038 |
|---|---|
| Data dodania do BaDAP | 2026-04-13 |
| Tekst źródłowy | URL |
| DOI | 10.1088/1748-0221/21/01/C01028 |
| Rok publikacji | 2026 |
| Typ publikacji | referat w czasopiśmie |
| Otwarty dostęp |  |
| Creative Commons | |
| Czasopismo/seria | Journal of Instrumentation |
Abstract
We present a testing setup for a hybrid pixel array (HPAD) radiation detector with an on-chip and in-pixel Artificial Neural Network (ANN). The setup takes advantage of the Integrated Circuit (IC) design, which supports testing of its individual blocks, and allows for full characterization of the IC as well as facilitates training of per-pixel ANN. The setup is dedicated to testing of an “IntelPixel” detector. The IntelPixel integrated circuit was designed at AGH University of Krakow as a matrix of 8 x 8 square-shaped pixels, each 200 μm pitch. In every pixel, there is a charge-sensitive amplifier followed by a shaper, an analog-to-digital converter, and ANN. The presented system design emphasize focusing on device-under-test rather than embedded system design itself. It consists of NI sbRIO 9609, an embedded and commercially available controller incorporated with an FPGA and microcontroller. It is connected to the power and bias distribution board, that also hosts a small daughterboard with the IntelPixel ASIC. Along with basic IO operations, presented system provides fast data analysis and high data throughout. The tested IC is packaged and uses a socket allowing for quick exchange of individual units. We present details of our platform allowing for full characterization of all the IC's components including charge amplifier, ADC, discriminator and an ANN.
