Szczegóły publikacji
Opis bibliograficzny
Graphene-based organic semiconductor composites for low-temperature-grade energy harvesting: from cell to module / Sajid Muhammad, Szymon GOGOC, Marcello Franzini, Simone Galliano, Claudia Barolo, Andrea Reale // Energy Reports [Dokument elektroniczny]. — Czasopismo elektroniczne ; ISSN 2352-4847 . — 2025 — vol. 14, s. 4006–4014. — Bibliogr. s. 4014, Abstr. — Publikacja dostępna online od: 2025-11-18
Autorzy (6)
- Muhammad Sajid
- AGHGogoc Szymon
- Franzini Marcello
- Galliano Simone
- Barolo Claudia
- Reale Andrea
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 164765 |
|---|---|
| Data dodania do BaDAP | 2026-01-14 |
| Tekst źródłowy | URL |
| DOI | 10.1016/j.egyr.2025.11.020 |
| Rok publikacji | 2025 |
| Typ publikacji | artykuł w czasopiśmie |
| Otwarty dostęp |  |
| Creative Commons | |
| Czasopismo/seria | Energy Reports |
Abstract
Thermoelectric (TE) materials are promising for converting waste heat into electricity. This study presents a printable TE paste with graphene nanoplatelets (GNPs) and poly(3-hexylthiophene) (P3HT), using various filler-to-semiconductor ratios (2:1, 1:1, 1:2). The impact of the dopant Lithium bis(trifluoromethanesulfonyl) imide (LiTFSI) and Tributyl phosphate (TBP), together with the ceramic spacer comprising Titanium oxide nanoparticles (TiO2 NPs), has been investigated on films, pellets, and a module. For a 1:2 ratio, doping has led to significant enhancement in electrical conductivity and Power factor (PF) for the films of GNP:P3HT composite, which increased from 40 S/m to 140 S/m and 35 nW/mK2 to 1022 nW/mK2, respectively. The Seebeck coefficient of the composite incorporating a TiO2 NPs spacer reached 160 μV/K at a temperature difference of 40 ˚C. A three-dimensional structure, described as a cylindrical pellet, also resulted in notable modifications to the ratios, filler, and spacer. An optimized GNP:P3HT (LiTFSI) pellet was employed to construct a TE module for practical performance assessment. Achieving a maximum power output (Pmax) of ∼0.38 μW/cm2 for a module for a temperature difference of 35 ˚C vs room temperature, this methodology could lead to the fabrication of high-efficiency TE real devices.
