Szczegóły publikacji

Opis bibliograficzny

Comparison of $Cu_{1.3}Mn_{1.7}O_{4}$ spinels doped with Ni or Fe and synthesized via wet chemistry and solid-state reaction methods, designed as potential coating materials for metallic interconnects / Łukasz MAZUR, Damian Koszelow, Marek ZAJUSZ, Marcin Łapiński, Maciej BIK, Patryk ZAJĄC, Anna ADAMCZYK, Paweł RUTKOWSKI, Sebastian Molin, Tomasz BRYLEWSKI // Journal of the European Ceramic Society ; ISSN 0955-2219. — Tytuł poprz.: International Journal of High Technology Ceramics. — 2023 — vol. 43 iss. 13, s. 5557–5574. — Bibliogr. s. 5572–5574, Abstr. — Publikacja dostępna online od: 2023-05-09


Autorzy (10)


Słowa kluczowe

protective ceramic coatingselectrical propertiesinterconnectsmanganese-copper spinelSOFC/SOEC

Dane bibliometryczne

ID BaDAP147429
Data dodania do BaDAP2023-07-10
Tekst źródłowyURL
DOI10.1016/j.jeurceramsoc.2023.05.015
Rok publikacji2023
Typ publikacjiartykuł w czasopiśmie
Otwarty dostęptak
Czasopismo/seriaJournal of the European Ceramic Society

Abstract

The influence of the method applied to synthesize Cu-Mn-O spinel was evaluated. The methods selected for the investigation were EDTA gel processes and solid-state reaction synthesis. From the obtained powders, sinters were prepared and assessed in terms of their properties as potential coating materials. Additionally, the influence of Ni and Fe dopants was evaluated. The results show that the EDTA gel processes method seems to be more suitable for spinel synthesis. This method yields spinels that exhibit electrical conductivity above the required threshold (>50 S/cm) over a temperature range of 400–850 °C, and it also ensures continuous spinel matrices and high spinel content. Spinels obtained via solid-state reactions exhibit inferior properties. A higher concentration of Ni allows electrical conductivity to be improved further, while the opposite tendency is observed for Fe. Finally, it was shown that spinels obtained via EDTA gel processes are promising protective-conducting coating materials for SOEC/SOFCs steel interconnects.

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