Szczegóły publikacji
Opis bibliograficzny
Electron backscatter diffraction (EBSD) as a tool for analysis of metal flow in aluminum extrusion / Pires Michael V., MADURA Jacek, Misiołek Wojciech Z., LEŚNIAK Dariusz, ZASADZIŃSKI Józef, Jurczak Henryk // W: ESAFORM 2023 : 26th international ESAFORM conference on Material Forming : 19–21 April 2023, Kraków, Poland / eds. Łukasz Madej, Mateusz Sitko, Konrad Perzyński. — Millersville : Materials Research Forum LLC, cop. 2023. — (Materials Research Proceedings ; ISSN 2474-3941 ; vol. 28). — ISBN: 978-1-64490-246-2; e-ISBN: 978-1-64490-247-9. — S. 437–444. — Bibliogr. s. 444, Abstr. — Dostęp również online: https://d21zja6o12zyp0.cloudfront.net/9781644902479.pdf [2023-04-24]
Autorzy (6)
- Pires Michael V.
- AGHMadura Jacek
- Misiołek Wojciech Z.
- AGHLeśniak Dariusz
- AGHZasadziński Józef
- Jurczak Henryk
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 146395 |
|---|---|
| Data dodania do BaDAP | 2023-04-24 |
| DOI | 10.21741/9781644902479-48 |
| Rok publikacji | 2023 |
| Typ publikacji | materiały konferencyjne (aut.) |
| Otwarty dostęp |  |
| Creative Commons | |
| Czasopismo/seria | Materials Research Proceedings |
Abstract
Electron backscatter diffraction was used to analyze the crystallographic texture within extruded AA6005 hollow profiles, allowing for the analysis of metal flow through various extrusion porthole die designs of different metal deformation conditions. Control of metal flow through a die design is necessary to meet industry demands for faster-running dies, tighter tolerances, thinner walls, and reduced extrusion loads. A standard die was compared with an innovative die design that doubled the extrusion exit speed. Analysis of metal flow was performed to provide additional insight into the uniformity of the metal flow, especially near the extrusion welds. Finite element method simulations were performed to predict the die exit temperature and plastic strain distributions. Local texture varied across the core and surface regions of the tube wall but remained consistent between both extrudates. A peripheral coarse grain structure was found within both extrudates, due to their elevated exit die temperatures.