Szczegóły publikacji
Opis bibliograficzny
Diamond composites of high thermal conductivity and low dielectric loss tangent / A. S. Osipov, P. Klimczyk, P. RUTKOWSKI, Y. A. Melniychuk, L. O. Romanko, M. Podsiadło, I. A. Petrusha, L. JAWORSKA // Materials Science and Engineering. B, Advanced Functional Solid-State Materials ; ISSN 0921-5107. — 2021 — vol. 269 art. no. 115171, s. 1–5. — Bibliogr. s. 5, Abstr. — Publikacja dostępna online od: 2021-04-17
Autorzy (8)
- Osipov A. S.
- Klimczyk Piotr
- AGHRutkowski Paweł
- Melniychuk Y. A.
- Romanko L. A.
- Podsiadło Marcin
- Petrusha I. A.
- AGHJaworska Lucyna Renata
Słowa kluczowe
Dane bibliometryczne
ID BaDAP | 133578 |
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Data dodania do BaDAP | 2021-04-21 |
Tekst źródłowy | URL |
DOI | 10.1016/j.mseb.2021.115171 |
Rok publikacji | 2021 |
Typ publikacji | artykuł w czasopiśmie |
Otwarty dostęp | |
Czasopismo/seria | Materials Science and Engineering, B, Advanced Functional Solid-State Materials |
Abstract
Diamond-CaMg(CO3)2 and diamond-CaCO3 compacts were produced. Maximum values of high thermal conductivity of 540 W/m K, electrical resistivity of 2∙1011 ohm cm, dielectric constant of 47, and dielectric loss tangent of 5.8∙10-3 at 106 Hz were achieved. The composites based on diamonds were sintered at a high pressure of 8.0 GPa and temperature of 2100 °C and were characterised by high ratios of direct bonding between the diamond grains. Diamond grain size varied from 12 to 45 µm. The CaCO3 content of the diamond-CaCO3 composites and the CaMg(CO3)2 content of the diamond-CaMg(CO3)2 composites were 8.5 vol% and 8.8 vol%, respectively. The materials developed are recommended for use as heat sinks in a wide range of electronic devices.