Szczegóły publikacji
Opis bibliograficzny
Enhanced catalytic performance in low-temperature $NH_{3}-SCR$ process of spherical MCM-41 modified with Cu by template ion-exchange and ammonia treatment / Aleksandra Jankowska, Agata Chłopek, Andrzej Kowalczyk, Małgorzata Rutkowska, Włodzimierz MOZGAWA, Marek Michalik, Shiquan Liu, Lucjan Chmielarz // Microporous and Mesoporous Materials ; ISSN 1387-1811. — 2021 — vol. 315 art. no. 110920, s. 1–12. — Bibliogr. s. 11–12, Abstr. — Publikacja dostępna online od: 2021-01-31. — A. Jankowska – afiliacja: Faculty of Chemistry, Jagiellonian University
Autorzy (8)
- Jankowska Aleksandra
- Chłopek Agata
- Kowalczyk Andrzej
- Rutkowska Małgorzata
- AGHMozgawa Włodzimierz
- Michalik Marek
- Liu Shiquan
- Chmielarz Lucjan
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 132857 |
|---|---|
| Data dodania do BaDAP | 2021-03-09 |
| Tekst źródłowy | URL |
| DOI | 10.1016/j.micromeso.2021.110920 |
| Rok publikacji | 2021 |
| Typ publikacji | artykuł w czasopiśmie |
| Otwarty dostęp |  |
| Czasopismo/seria | Microporous and Mesoporous Materials |
Abstract
Spherical MCM-41 (S-MCM-41) was synthesised and used as support for deposition of copper by template ion-exchange (TIE) method using CuCl2 solutions. Another series of catalysts was prepared by modified TIE procedure, including treatment of S-MCM-41, directly after TIE, with ammonia solution (TIE-NH3). The samples were characterized with respect to chemical composition (ICP-OES), texture (N2-sorption), structure (XRD, FTIR), morphology and surface composition (SEM-EDS), aggregation of copper species (UV–vis-DRS), reducibility (H2-TPR) and surface acidity (NH3-TPD). It was shown that deposition of copper by TIE method resulted in samples containing simultaneously highly dispersed copper species as well as CuO nanorods. The TIE-NH3 procedure resulted in deposition of highly dispersed copper species located mainly inside pores without formation of CuO crystallites. The samples obtained by TIE-NH3 method were found to be very promising catalysts for the low-temperature NH3-SCR process, possibly due to the presence of large number of highly dispersed copper species, deposited on the large surface area of S-MCM-41.
