Szczegóły publikacji

Opis bibliograficzny

Soldering of $Mg$ joints using $Zn-Al$ solders / Tomasz Gancarz, Katarzyna BERENT, Wojciech Skuza, Katarzyna Janik // Metallurgical and Materials Transactions. A, Physical Metallurgy and Materials ; ISSN 1073-5623. — 2018 — vol. 49A iss. 7, s. 2684–2691. — Bibliogr. s. 2691. — Publikacja dostępna online od: 2018-04-18

Autorzy (4)

Dane bibliometryczne

ID BaDAP114970
Data dodania do BaDAP2018-07-16
Tekst źródłowyURL
DOI10.1007/s11661-018-4617-0
Rok publikacji2018
Typ publikacjiartykuł w czasopiśmie
Otwarty dostęptak
Creative Commons
Czasopismo/seriaMetallurgical and Materials Transactions, A, Physical Metallurgy and Materials Science

Abstract

Magnesium has applications in the automotive and aerospace industries that can significantly contribute to greater fuel economy and environmental conservation. The Mg alloys used in the automotive industry could reduce mass by up to 70 pct, providing energy savings. However, alongside the advantages there are limitations and technological barriers to use Mg alloys. One of the advantages concerns phenomena occurring at the interface when joining materials investigated in this study, in regard to the effect of temperature and soldering time for pure Mg joints. Eutectic Zn-Al and Zn-Al alloys with 0.05 (wt pct) Li and 0.2 (wt pct) Na were used in the soldering process. The process was performed for 3, 5, and 8 minutes of contact, at temperatures of 425 A degrees C, 450 A degrees C, 475 A degrees C, and 500 A degrees C. Selected, solidified solder-substrate couples were cross-sectioned, and their interfacial microstructures were investigated by scanning electron microscopy. The experiment was designed to demonstrate the effect of time, temperature, and the addition of Li and Na on the kinetics of the dissolving Mg substrate. The addition of Li and Na to eutectic Zn-Al caused to improve mechanical properties. Higher temperatures led to reduced joint strength, which is caused by increased interfacial reaction.

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