Szczegóły publikacji
Opis bibliograficzny
Epoxy composites with ceramic core-shell fillers for thermal management in electrical devices / Andrzej Rybak, Karolina GĄSKA, Czesław KAPUSTA, François Toche, Vincent Salles // Polymers for Advanced Technologies ; ISSN 1042-7147. — 2017 — vol. 28 iss. 12, s. 1676-1682. — Bibliogr. s. 1682
Autorzy (5)
- Rybak Andrzej
- AGHGąska Karolina
- AGHKapusta Czesław
- Toche François
- Salles Vincent
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 111624 |
|---|---|
| Data dodania do BaDAP | 2018-01-15 |
| Tekst źródłowy | URL |
| DOI | 10.1002/pat.4038 |
| Rok publikacji | 2017 |
| Typ publikacji | artykuł w czasopiśmie |
| Otwarty dostęp |  |
| Czasopismo/seria | Polymers for Advanced Technologies |
Abstract
In this work, a novel core-shell material has been manufactured in order to enhance the thermal conductivity of epoxy-based composites. The polymer derived ceramics technique has been used to produce fillers whose core is composed of a standard material - silica, and whose outer layer consists of a boron nitride or silicon nitride shell. The synthesized filler was characterized by infrared spectroscopy, X-ray diffraction, and scanning electron microscopy coupled with an energy dispersive spectroscopy analysis. The successful formation of core-shell structure was proven. Composite samples based on an epoxy resin filled with 31vol% of synthetized core-shell filler have been investigated in order to determine the effective thermal conductivity of the modified system. The resulting core-shell composite samples exhibited improvements in thermal conductivity of almost 30% in relation to standard systems, making them a promising material for heat management applications. Additionally, the temperature dependence of the thermal conductivity was investigated over a broad temperature range indicating that the thermal behavior of the composite with incorporated core-shell filler is stable. This stability is a crucial factor when considering the potential of using this technology in applications such as electronics and power systems.
