Szczegóły publikacji
Opis bibliograficzny
Mechanical properties of solid-state recycled 4xxx aluminum alloy chips / Tomasz TOKARSKI // Journal of Materials Engineering and Performance ; ISSN 1059-9495. — 2016 — vol. 25 iss. 8, s. 3252–3259. — Bibliogr. s. 3259. — Publikacja dostępna online od: 2016-06-28. — EUROMAT 2015 : European congress and exhibition on advanced materials and processes : September 20-24, 2015, Warsaw, Poland
Autor
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 102333 |
|---|---|
| Data dodania do BaDAP | 2016-12-21 |
| Tekst źródłowy | URL |
| DOI | 10.1007/s11665-016-2194-1 |
| Rok publikacji | 2016 |
| Typ publikacji | referat w czasopiśmie |
| Otwarty dostęp |  |
| Czasopismo/seria | Journal of Materials Engineering and Performance |
Abstract
The direct production of aluminum from bauxite ores is known to be a very energetic-intensive operation compared to other metallurgical processes. Due to energy issues and the rapid increase in aluminum demand, new kinds of aluminum production processes are required. Aluminum waste recycling, which has an advantage of lowering the cost of electric power consumption, is considered to be an alternative route for material manufacturing. In this work, the way of reusing aluminum EN-AC 44000 alloy scraps by hot extrusion was presented. Metal chips of different sizes and morphology were cold compacted into billet form and then hot extruded. Mechanical properties investigations combined with microstructure observations were performed. Mechanical anisotropy behavior of material was evaluated on the base of tensile test experiments performed on samples machined at 0A degrees, 45A degrees, and 90A degrees, respectively, to the extrusion direction. It was found that the initial size of the chips has an influence on the mechanical properties of the received profiles. Samples produced from fine chips revealed higher tensile strength in comparison to larger chips, which can be attributed to a refined microstructure containing fine, hard Si particles and Fe-rich intermetallic phases. Finally, it was found that anisotropic behavior of chip-based profiles is similar to conventionally cast and extruded materials which prove good bonding quality between chips.
