Szczegóły publikacji
Opis bibliograficzny
Wideband microstrip to 3-D-printed air-filled waveguide transition using a radiation probe / Ilona PIEKARZ, Jakub SOROCKI, Nicolò Delmonte, Lorenzo Silvestri, Stefania Marconi, Gianluca Alaimo, Ferdinando Auricchio, Maurizio Bozzi // IEEE Microwave and Wireless Components Letters ; ISSN 1531-1309. — 2022 — vol. 32 no. 10, s. 1179–1182. — Bibliogr. s. 1182, Abstr. — Publikacja dostępna online od: 2022-05-19. — I. Piekarz, J. Sorocki - dod. afiliacja: Department of Electrical, Computer and Biomedical Engineering, University of Pavia, Pavia, Italy
Autorzy (8)
- AGHPiekarz Ilona Kinga
- AGHSorocki Jakub
- Delmonte Nicolo
- Silvestri Lorenzo
- Marconi Stefania
- Alaimo Gianluca
- Auricchio Ferdinando
- Bozzi Maurizio
Słowa kluczowe
Dane bibliometryczne
| ID BaDAP | 150556 |
|---|---|
| Data dodania do BaDAP | 2024-01-11 |
| Tekst źródłowy | URL |
| DOI | 10.1109/LMWC.2022.3173407 |
| Rok publikacji | 2022 |
| Typ publikacji | artykuł w czasopiśmie |
| Otwarty dostęp |  |
| Creative Commons | |
| Czasopismo/seria | IEEE Microwave and Wireless Components Letters |
Abstract
In this letter, a novel wideband microstrip to additively fabricated waveguide transition is presented. The proposed design takes advantage of the flexibility of 3-D printing to realize a highly integrated transition from the microstrip line on a printed circuit board (PCB) to an air-filled waveguide using an additively manufactured radiating probe. The idea is experimentally verified by the realization of an exemplary transition working within the X-band at $f_{0} =10.5$ GHz. The measured performance of the back-to-back transition proves its usefulness and possibility of utilization in highly integrated PCB-waveguide circuits. A PolyJet printing technology with copper electroplating was used in combination with PCB on microwave grade laminate. A bandwidth of $f_{H}/f_{L} =1.8$ was obtained with the impedance match better than 9.5 dB and in-band insertion loss per transition below 1.1 dB.